INDUSTRY

Electronics

High accuracy and precision of CMES 3D vision technology and the robot guidance solution minimizes product damage that can occur during robot transit. Simplified process setting from the automatic teaching function enables manufacturing efficiency to be maximized..

01 Semiconductor

Wafer (un)loading application & alignment

· Wafer Loading/Unloading Application: 3D Vision recognizes the wafer cassette carrier for delivering robot pass generated with automatic teaching to wafer transfer robot and for robot to carry out wafer loading/unloading.
· Alignment: If the position changes in the wafer cassette carrier, 3D Vision recognizes the cassette position and automatically adjusts the robot path.

01 Semiconductor
Features
  • Simplified process setting with automatic teaching instead of using manual teaching
  • Accuracy in position adjustment
02 Home appliance production

Cutting & welding guidance

· Refrigerator Coolant Injection Pipe Cutting Guidance: It is an application that uses 3D vision to accurately recognize the coupler shape attached to the coolant inlet in order to guide the welding robot position. · Welding Guidance: It is an application that uses 3D vision to shoot the compressor pipe welding position on the refrigerator so that the robot can easily carry out welding.
02 Home appliance production
Features
  • Accurate recognition of 3D shape and position for coupler and pipe welding part
  • Recognition of various sizes of welding parts and ositions for application on small quantity and batch production line
  • Compatibility with different kinds of industrial-use and collaborative robot
03
AGV / AMR

AGV /AMR (6 axis position adjustment )

CMES AGV/AMR six-axis adjustment solution inputs 3D vision into AGV/AMR to carry out accurate work by considering AGV/AMR position error and adjusting the position.
03
AGV / AMR
Features
  • Solution with price competitiveness
  • Simple process setting without using a PC by applying a smart sensor
  • Shortened cycle time by skipping communication time
04
Mobile phone

Bin picking (Mobile phone)

It is an application equipped with the CMES bin picking solution applied with AI to accurately recognize an object in the bin and generate a robot path and gripping point and insert into a certain position in the finished goods box.
04
Mobile phone
Features
  • Accurate recognition of different kinds of components using Deep Learning
  • Set-up of multi gripping point
  • Compatibility with different kinds of industrial-use and collaborative robot

APPLICATION

CMES YouTube

Scroll to Top